A student was given the task to use CMP to thin a wafer. The student used a standard slurry recipe for the CMP machine. After one hour of polishing, the wafer was thinned by ∼ 2.2 m . The student then increased the rotational speed of the CMP machine by 3 times and the polishing proceeded for another hour. What is the total thickness thinned? Estimate your answer using: The Preston Model